The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 08, 2013
Filed:
Dec. 21, 2010
Kyung-wan Park, Gyeonggi-do, KR;
Shi-yun Cho, Gyeonggi-do, KR;
Byung-jik Kim, Gyeonggi-do, KR;
Ho-seong Seo, Gyeonggi-do, KR;
Youn-ho Choi, Seoul, KR;
Yu-su Kim, Gyeonggi-do, KR;
Seok-myong Kang, Gyeonggi-do, KR;
Ji-hyun Jung, Gyeonggi-do, KR;
Kyung-Wan Park, Gyeonggi-do, KR;
Shi-Yun Cho, Gyeonggi-do, KR;
Byung-Jik Kim, Gyeonggi-do, KR;
Ho-Seong Seo, Gyeonggi-do, KR;
Youn-Ho Choi, Seoul, KR;
Yu-Su Kim, Gyeonggi-do, KR;
Seok-Myong Kang, Gyeonggi-do, KR;
Ji-Hyun Jung, Gyeonggi-do, KR;
Samsung Electronics Co., Ltd, , KR;
Abstract
An embedded circuit board is disclosed including a first copper clad laminate formed with a plurality of cavities and including a plurality of chips having different thicknesses embedded in the cavities, a second copper clad laminate provided in the cavities to allow the first copper clad laminate to level with the chips; and a resin coated copper foil provided on upper surfaces of the first and second copper clad laminates.