The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 08, 2013

Filed:

Apr. 26, 2010
Applicants:

Hideki Etori, Sakura, JP;

Hiroshi Isozumi, Tokyo, JP;

Masanori Kasai, Tokyo, JP;

Inventors:

Hideki Etori, Sakura, JP;

Hiroshi Isozumi, Tokyo, JP;

Masanori Kasai, Tokyo, JP;

Assignee:

DIC Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
A61K 9/16 (2006.01); B05D 5/12 (2006.01); B60C 1/00 (2006.01); C04B 26/12 (2006.01); C08G 18/08 (2006.01); C08G 18/28 (2006.01); C08G 18/42 (2006.01); C08G 59/50 (2006.01); C08G 63/00 (2006.01); C08G 64/16 (2006.01); C08G 67/02 (2006.01); C08G 69/00 (2006.01); C08K 3/10 (2006.01); C08K 3/22 (2006.01); C08K 5/01 (2006.01); C08K 5/24 (2006.01); C08K 5/54 (2006.01); C08L 51/00 (2006.01); C08L 53/00 (2006.01); C08L 61/00 (2006.01); C08L 75/00 (2006.01); C09D 5/00 (2006.01); C09D 11/00 (2006.01); G02B 5/22 (2006.01); G02F 1/00 (2006.01); H01C 17/06 (2006.01); H04N 5/70 (2006.01);
U.S. Cl.
CPC ...
Abstract

There is provided an ink composition for forming a light shielding film in an organic semiconductor device which is capable of stably forming a fine pattern when forming a finely patterned light shielding film by the letterpress reverse printing method or microcontact printing method, which can be baked at a temperature equal to or less than the substrate heatproof temperature, and which is also capable of providing light shielding property and mechanical strength, the ink composition for forming a light shielding film in an organic semiconductor device which is an ink composition for forming a light shielding film in an organic semiconductor device comprising a black pigment; a resin component; a surface energy modifier; a quick-drying organic solvent; a slow-drying organic solvent; and a mold releasing agent, wherein the resin component comprises a solid resin that is in a solid state at 200° C. or less and a liquid resin that is in a liquid state at 10 to 50° C. at a ratio (solid resin/liquid resin) of 0.2 to 0.6.


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