The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 08, 2013
Filed:
Mar. 22, 2012
Applicant:
Satoshi Hatsukawa, Osaka, JP;
Inventor:
Satoshi Hatsukawa, Osaka, JP;
Assignee:
Sumitomo Electric Industries, Ltd., Osaka-shi, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
A method of manufacturing a semiconductor device comprises the steps of forming a film on a main face of a semiconductor substrate having a plurality of device forming regions for forming semiconductor devices, the film having a coefficient of thermal expansion different from that of the semiconductor substrate and including a cutout on a region between the plurality of device forming regions; forming the semiconductor devices in the respective device forming regions by using the film; and dividing the semiconductor substrate into the respective device forming regions.