The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 08, 2013
Filed:
Oct. 07, 2011
Kenshi Fukumitsu, Hamamatsu, JP;
Fumitsugu Fukuyo, Hamamatsu, JP;
Naoki Uchiyama, Hamamatsu, JP;
Ryuji Sugiura, Hamamatsu, JP;
Kazuhiro Atsumi, Hamamatsu, JP;
Kenshi Fukumitsu, Hamamatsu, JP;
Fumitsugu Fukuyo, Hamamatsu, JP;
Naoki Uchiyama, Hamamatsu, JP;
Ryuji Sugiura, Hamamatsu, JP;
Kazuhiro Atsumi, Hamamatsu, JP;
Hamamatsu Photonics K.K., Hamamatsu-shi, Shizuoka, JP;
Abstract
A wafer having a front face formed with a functional device is irradiated with laser light while positioning a light-converging point within the wafer with the rear face of the wafer acting as a laser light incident face, so as to generate multiphoton absorption, thereby forming a starting point region for cutting due to a molten processed region within the wafer along a line. Consequently, a fracture can be generated from the starting point region for cutting naturally or with a relatively small force, so as to reach the front face and rear face. Therefore, when an expansion film is attached to the rear face of the wafer by way of a die bonding resin layer after forming the starting point region for cutting and then expanded, the wafer and die bonding resin layer can be cut along the line.