The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 08, 2013
Filed:
Jul. 21, 2009
Kazuyuki Oogi, Chiba, JP;
Sadaki Yamamoto, Chiba, JP;
Masanobu Sato, Tokyo, JP;
Du Pont-Mitsui Polychemicals Co., Ltd., Tokyo, JP;
Abstract
A resin molding apparatus of a simplified structure is provided that offers high handling efficiency by a work robot, thereby improving a throughput. The resin molding apparatus () that retains a hollow molded body () including a closed-bottom cylindrical main body () and a cylindrical open neck portion (), the open neck portion () including a helical ridge portion () formed on an outer circumferential surface thereof and divided into a plurality of helical segments by a slit () extending in an axial direction of the open neck portion (), and that overmolds a resin sheathing body () on an outer surface of the main body (), includes a first recess in which the open neck portion () is to be fitted, and a rib () formed on a circumferential surface of the recess so as to extend in a depthwise direction thereof, and to be engaged with the slit ().