The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 08, 2013
Filed:
Dec. 07, 2009
Satoshi Miyagawa, Nagoya, JP;
Naoki Kato, Nagoya, JP;
Yasuaki Ozeki, Nagoya, JP;
Hiroto Matsushita, Nagoya, JP;
Masamitsu Saji, Nagoya, JP;
Yasuo Okochi, Nagoya, JP;
Toshihiko Kariya, Nagoya, JP;
Koji Kubota, Nagoya, JP;
Satoshi Miyagawa, Nagoya, JP;
Naoki Kato, Nagoya, JP;
Yasuaki Ozeki, Nagoya, JP;
Hiroto Matsushita, Nagoya, JP;
Masamitsu Saji, Nagoya, JP;
Yasuo Okochi, Nagoya, JP;
Toshihiko Kariya, Nagoya, JP;
Koji Kubota, Nagoya, JP;
Mitsubishi Heavy Industries Plastic Technology Co., Ltd., Nagoya-shi, Aichi, JP;
Abstract
It is an object to prevent dies from interfering with each other when the dies are closed and effectively prevent overshoot of cavity temperature while efficiently performing heating of the dies. In an injection molding machine for two-material molding including two sets of a first injecting unit and a second injecting unit that respectively plasticize different resin materials and inject and fill the resin materials, prior to performing injection molding on the first injecting unit side on a secondary side, after injection molding on the second injecting unit side on a primary side, heating of the dies is started before 180-degree rotation of a rotary die plate is completed. After the start of heating, until the 180-degree rotation of the rotary die plate is completed, i.e., die closing is performed, die temperatures are maintained within a temperature range set higher than die temperatures during the heating start and lower than die temperatures during injection.