The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 08, 2013

Filed:

Aug. 26, 2011
Applicants:

Takayuki Saito, Hitachinaka, JP;

Chihiro Kobayashi, Naka, JP;

Inventors:

Takayuki Saito, Hitachinaka, JP;

Chihiro Kobayashi, Naka, JP;

Assignee:

Hitachi Automotive Systems, Ltd., Hitachinaka-shi, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01D 11/24 (2006.01); G01L 19/14 (2006.01); G01P 1/02 (2006.01);
U.S. Cl.
CPC ...
Abstract

Provided is a sensor structure capable of improving the reliability of connecting parts of electronic components and achieving excellent productivity and reduction in size and weight, for example, when electronic components are externally mounted on input/output terminals of a sensor. A relationship between a linear expansion coefficient for a housing serving as a base of a structure and a linear expansion coefficient of a resin material for a sensor casing of a sensor to be mounted is set to satisfy 'sensor casing<linear expansion coefficient α<housing'. When electronic components are externally mounted, the electric components are mounted on input/output terminals which are integrally formed on the side of a component having a small linear expansion coefficient, i.e., on the side of the sensor casing.


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