The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 01, 2013

Filed:

Jan. 13, 2011
Applicants:

Abdelaziz Ikhlef, Hartland, WI (US);

Brian Joseph Graves, Waukesha, WI (US);

Gregory S. Zeman, Waukesha, WI (US);

Joseph James Lacey, Cambridge, WI (US);

Mayank Gupta, Brookfield, WI (US);

Baiju Zacharia Babu, Waukesha, WI (US);

Ross Hoggatt, Waukesha, WI (US);

Inventors:

Abdelaziz Ikhlef, Hartland, WI (US);

Brian Joseph Graves, Waukesha, WI (US);

Gregory S. Zeman, Waukesha, WI (US);

Joseph James Lacey, Cambridge, WI (US);

Mayank Gupta, Brookfield, WI (US);

Baiju Zacharia Babu, Waukesha, WI (US);

Ross Hoggatt, Waukesha, WI (US);

Assignee:

General Electric Company, Schenectady, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05G 1/60 (2006.01);
U.S. Cl.
CPC ...
Abstract

A CT system is disclosed that includes detector modules positioned on a rotatable gantry configured to receive x-rays attenuated by an object. Each detector module includes a module frame, a plurality of tileable sub-modules on the module frame aligned along a Z-axis thereof to receive the x-rays attenuated by the object and convert the x-rays to digital signals, and an electronics board connected to the plurality of sub-modules to receive the digital signals. Each sub-module further includes an array of detector elements to receive x-rays attenuated through the object and convert the x-rays into analog electrical signals, an ASIC electronics package coupled to the array of detector elements to receive the analog electrical signals and convert the analog electrical signals to digital signals, and a flex circuit connected to the ASIC electronics package to receive the digital signals and transfer the digital signals to the electronics board.


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