The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 01, 2013
Filed:
Oct. 21, 2008
Norio Nakazato, Inzai, JP;
Kimihiko Sudo, Yokohama, JP;
Hiroshi Akai, Fujisawa, JP;
Naoki Yotsumoto, Tachikawa, JP;
Hiroshi Oyama, Hitachi, JP;
Shigeyuki Sasaki, Kasumigaura, JP;
Atsushi Hatakeyama, Ome, JP;
Takaaki Maruyama, Ome, JP;
Kouichi Tanabe, Ome, JP;
Norio Nakazato, Inzai, JP;
Kimihiko Sudo, Yokohama, JP;
Hiroshi Akai, Fujisawa, JP;
Naoki Yotsumoto, Tachikawa, JP;
Hiroshi Oyama, Hitachi, JP;
Shigeyuki Sasaki, Kasumigaura, JP;
Atsushi Hatakeyama, Ome, JP;
Takaaki Maruyama, Ome, JP;
Kouichi Tanabe, Ome, JP;
Hitachi Consumer Electronics Co., Ltd., Tokyo, JP;
Abstract
It is to provide a light source module capable of downsizing an edge-light type backlight in thickness and reducing the usage amount of resin. A method of manufacturing a light source module includes a process of preparing a substrate with a first reflector including a reflecting surface mounted thereon, a process of mounting a plurality of light emitting elements on the substrate, a process of mounting a wiring board having an electrode on the substrate, a process of connecting the electrode of the light emitting element and the electrode of the wiring board with metal wire, a process of mounting a second reflector having a reflecting surface on the wiring board, and a process of filling the space between the first reflector and the second reflector, with resin.