The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 01, 2013
Filed:
Sep. 01, 2011
Takashi Habu, Ibaraki, JP;
Fumiteru Asai, Ibaraki, JP;
Tomokazu Takahashi, Ibaraki, JP;
Eiichi Imoto, Ibaraki, JP;
Yuta Shimazaki, Ibaraki, JP;
Takashi Habu, Ibaraki, JP;
Fumiteru Asai, Ibaraki, JP;
Tomokazu Takahashi, Ibaraki, JP;
Eiichi Imoto, Ibaraki, JP;
Yuta Shimazaki, Ibaraki, JP;
Nitto Denko Corporation, Osaka, JP;
Abstract
The present invention provides a pressure-sensitive adhesive sheet for protecting a semiconductor wafer, which does not cause curve (warpage) in the semiconductor wafer, when the semiconductor wafer is ground, is excellent in followability to a pattern, has adequate stress dispersibility in a grinding operation, suppresses the crack in a wafer and chipping in a wafer edge, and does not leave a residue of a tackiness agent on the surface of the wafer. The protective sheet has one face having tackiness, does not have an interface existing between a substrate and the tackiness agent and is made of one layer, and the pressure-sensitive adhesive sheet has different tack strengths on both faces from each other.