The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 01, 2013
Filed:
Dec. 29, 2006
Kenji Sasaki, Tokyo, JP;
Tomonori Tanoue, Tokyo, JP;
Sakae Kikuchi, Tokyo, JP;
Toshifumi Makino, Tokyo, JP;
Takeshi Sato, Tokyo, JP;
Tsutomu Kobori, Tokyo, JP;
Yasunari Umemoto, Tokyo, JP;
Takashi Kitahara, Tokyo, JP;
Kenji Sasaki, Tokyo, JP;
Tomonori Tanoue, Tokyo, JP;
Sakae Kikuchi, Tokyo, JP;
Toshifumi Makino, Tokyo, JP;
Takeshi Sato, Tokyo, JP;
Tsutomu Kobori, Tokyo, JP;
Yasunari Umemoto, Tokyo, JP;
Takashi Kitahara, Tokyo, JP;
Murata Manufacturing Co., Ltd., Kyoto, JP;
Abstract
A technology is provided so that RF modules used for cellular phones etc. can be reduced in size. Over a wiring board constituting an RF module, there are provided a first semiconductor chip in which an amplifier circuit is formed and a second semiconductor chip in which a control circuit for controlling the amplifier circuit is formed. A bonding pad over the second semiconductor chip is connected with a bonding pad over the first semiconductor chip directly by a wire without using a relay pad. In this regard, the bonding pad formed over the first semiconductor chip is not square but rectangular (oblong).