The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 01, 2013
Filed:
Dec. 06, 2011
Sang-geun Kim, Cheonan-si, KR;
Dong-chul Han, Cheonan-si, KR;
Seok Goh, Cheonan-si, KR;
Jeong-hoon Kim, Cheonan-si, KR;
Sang-Geun Kim, Cheonan-si, KR;
Dong-Chul Han, Cheonan-si, KR;
Seok Goh, Cheonan-si, KR;
Jeong-Hoon Kim, Cheonan-si, KR;
Samsung Electronics Co., Ltd., Suwon-si, KR;
Abstract
A stacked package and method of manufacture are provided. The stacked package may include a first semiconductor package, a second semiconductor package, plugs and spacers. The second semiconductor package may be stacked on the first semiconductor package. The plugs may electrically connect the first semiconductor to the second semiconductor package. The spacer may be interposed between the first semiconductor package and the second semiconductor package to form a gap between the first semiconductor package and the second semiconductor package, thereby preventing an electrical short between the plugs.