The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 01, 2013
Filed:
Sep. 01, 2011
Koji Shiroki, Nagaokakyo, JP;
Makoto Osamura, Nagaokakyo, JP;
Takeshi Kurihara, Nagaokakyo, JP;
Masami Mizuyama, Nagaokakyo, JP;
Koji Shiroki, Nagaokakyo, JP;
Makoto Osamura, Nagaokakyo, JP;
Takeshi Kurihara, Nagaokakyo, JP;
Masami Mizuyama, Nagaokakyo, JP;
Murata Manufacturing Co., Ltd., Kyoto, JP;
Abstract
An RFIC module includes an RFIC chip that is mounted on a mounting substrate and that is encapsulated with an encapsulation resin layer. The mounting substrate includes a flexible base and electrodes provided on the flexible base. External terminals are disposed near four corners of a mounting surface of the RFIC chip. One of a plurality of mounting lands located on the surface of the flexible base is a shared mounting land and defines an integrated mounting land that is shared by an RF terminal and an NC terminal of the RFIC chip. The shared mounting land is arranged to cover one side of the RFIC chip when viewed from above.