The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 01, 2013
Filed:
Jul. 18, 2008
Carlo Dall'aglio, Castello d'Argile Bo, IT;
Carlo Dall'Aglio, Castello d'Argile Bo, IT;
Marposs Societa'per Azioni, Bentivoglio (BO), IT;
Abstract
An apparatus for checking thickness dimensions in a semiconductor wafer () during grinding operations includes an optical probe () which transmits infrared radiations on the surface () being machined of the wafer (), and detects beams that are reflected by said surface, by an opposite surface () of the wafer and/or by surfaces () separating different layers in the wafer. The beam of emitted and reflected radiations travels along a path () with known and constant discontinuities, in part through the air () and in part through a cushion () of low flow liquid, which flows with substantially laminar flow. A support and positioning element () for the optical probe includes hydraulic ducts () that generate the liquid cushion. A method for checking the thickness dimensions includes the generation of the liquid cushion at the path along which the beam of emitted and reflected radiations travels.