The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 01, 2013
Filed:
Aug. 13, 2009
Applicants:
Min-chih Hsuan, Hinchu, TW;
Tsung-hsi Ko, Hsinchu, TW;
Li-che Chen, Pintung County, TW;
Inventors:
Assignee:
Other;
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01J 3/14 (2006.01); H01J 5/16 (2006.01);
U.S. Cl.
CPC ...
Abstract
A manufacturing method of a wafer level chip scale package of an image-sensing module is provided. The method includes providing a wafer having a plurality of die regions, and a plurality of sensing units is formed on a surface of the wafer in each die region. A plurality of lens units is formed on the sensing units, wherein each lens unit includes a lens and an edge wall that are integrally formed. A light-shielding film is also formed on a surface of at least one edge wall of at least one lens units. A dicing process is then performed on the wafer to form a plurality of image sensor chips.