The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 01, 2013
Filed:
Jan. 04, 2013
Applicant:
Texas Instruments Incorporated, Dallas, TX (US);
Inventors:
Assignee:
Texas Instruments Incorporated, Dallas, TX (US);
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
A method of forming an electronic assembly includes dispensing a die attach material on a substrate into a recessed portion that includes an inner recessed portion of including a die pad. The die attach material is not dispensed on an outer raised flat portion of the die pad. A semiconductor die is attached directly on the outer raised flat portion and affixed to the die pad with said die attach material in said interior recessed portion but not on said outer raised flat portion.
Ho, Chih-Chien. (2013). Package substrate having die pad with outer raised portion and interior recessed portion (U.S. Patent No. 8546184). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8546184
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile