The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 01, 2013

Filed:

Aug. 03, 2011
Applicants:

Gregory John Mcavoy, Dublin, IE;

Rónán Pádraig Seán O'reilly, Dublin, IE;

David Mcleod Johnstone, Balmain, AU;

Kia Silverbrook, Balmain, AU;

Inventors:

Gregory John McAvoy, Dublin, IE;

Rónán Pádraig Seán O'Reilly, Dublin, IE;

David McLeod Johnstone, Balmain, AU;

Kia Silverbrook, Balmain, AU;

Assignee:

Zamtec Ltd, Dublin, IE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41J 2/14 (2006.01); B41J 2/16 (2006.01);
U.S. Cl.
CPC ...
Abstract

A MEMS integrated circuit includes a silicon substrate having a frontside with a drive circuitry layer and a backside. A MEMS layer is disposed on the drive circuitry layer. The MEMS layer includes a plurality of MEMS devices electrically connected to the drive circuitry layer. Connector posts extends from the drive circuitry layer to a contact pad positioned in a roof of the MEMS layer and through-silicon connectors extending linearly from the contact pad, through the drive circuitry layer and the silicon substrate, towards the backside of the silicon substrate. Each through-silicon connector terminates at a backside integrated circuit contact, such that each integrated circuit contact is electrically connected to the drive circuitry layer via the contact pad positioned in the roof of the MEMS layer.


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