The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 01, 2013
Filed:
Nov. 28, 2007
Takaaki Morita, Tokyo, JP;
Takaaki Morita, Tokyo, JP;
TDK Corporation, Tokyo, JP;
Abstract
There is disclosed a collective mounting method of electronic components in which a plurality of electronic components can uniformly be pressed to an insulating layer in a short time in a case where the electronic components and a resin layer are fixed. To manufacture a semiconductor-embedded substratein which a plurality of semiconductor devicesare embedded, after disposing the plurality of semiconductor deviceson an unhardened resin layer, this is stored in a containerof a pressurizing and heating unit, the plurality of semiconductor devicesare simultaneously, collectively and isotropically pressurized by use of an internal gas in the containeras a pressure medium to simultaneously press the plurality of semiconductor devicesto the unhardened resin layer, and the resin layeris heated and hardened. In consequence, the plurality of semiconductor devicesare collectively and uniformly fixed and mounted onto the resin layerwithout being influenced by a state change of the resin layer