The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 24, 2013
Filed:
Nov. 09, 2010
Tsutomu Kono, Kawasaki, JP;
Hiroki Nakatsuchi, Yokohama, JP;
Keiji Suzuki, Hitachi, JP;
Mitsuru Onoda, Takahagi, JP;
Kazuo Goto, Mito, JP;
Yasuaki Kageyama, Hitachi, JP;
Hiroaki Kojima, Hitachi, JP;
Kenji Ikeda, Hitachinaka, JP;
Hisashi Morooka, Hitachinaka, JP;
Tsutomu Kono, Kawasaki, JP;
Hiroki Nakatsuchi, Yokohama, JP;
Keiji Suzuki, Hitachi, JP;
Mitsuru Onoda, Takahagi, JP;
Kazuo Goto, Mito, JP;
Yasuaki Kageyama, Hitachi, JP;
Hiroaki Kojima, Hitachi, JP;
Kenji Ikeda, Hitachinaka, JP;
Hisashi Morooka, Hitachinaka, JP;
Hitachi, Ltd., Tokyo, JP;
Abstract
The present method aims at preventing breakdown by selecting conditions for preventing the occurrence of voids via analysis. According to the present method, a database related to the time variation of amount of generated gas or number of moles when a solid member is heated is experimentally formulated in advance, and the amount of generated gas from the member and the specific heat ratio of gases are entered for analysis in order to predict via analysis the generation of voids within the resin material when the solid member is heated, to thereby select conditions for preventing voids.