The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 24, 2013
Filed:
Jun. 16, 2011
Jay W. Kokas, East Granby, CT (US);
Kevin P. Roy, West Springfield, MA (US);
Judy Schwartz, Longmeadow, MA (US);
Michael Maynard, Springfield, MA (US);
John D. Pennell, Enfield, CT (US);
Matthew S. Fitzpatrick, Portland, CT (US);
Richard M. Speziale, Winsted, CT (US);
Jay W. Kokas, East Granby, CT (US);
Kevin P. Roy, West Springfield, MA (US);
Judy Schwartz, Longmeadow, MA (US);
Michael Maynard, Springfield, MA (US);
John D. Pennell, Enfield, CT (US);
Matthew S. Fitzpatrick, Portland, CT (US);
Richard M. Speziale, Winsted, CT (US);
Hamilton Sundstrand Corporation, Windsor Locks, CT (US);
Abstract
A multi-hybrid module includes a plurality of hybrid assemblies that are perpendicularly mounted with respect to a plane of a circuit board. The hybrid assemblies are mounted on opposing sides of a heat sink. The heat sink has a first column disposed at a first end, a second column disposed at a second opposing end, and a generally flat center wall extending between the first column and the second column to which the hybrid assemblies are mounted. During operation the hybrid assemblies are mounted on edge perpendicular with respect to the circuit board to minimize an area profile of the multi-hybrid module on the circuit board.