The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 24, 2013

Filed:

May. 05, 2011
Applicants:

Susanne Arney, Highland Park, NJ (US);

Jen-hau Cheng, New Providence, NJ (US);

Paul R. Kolodner, Hoboken, NJ (US);

Krishna-murty Kota-venkata, Springfield, NJ (US);

William Scofield, Batavia, IL (US);

Todd R. Salamon, New Providence, NJ (US);

Maria E. Simon, New Providence, NJ (US);

Inventors:

Susanne Arney, Highland Park, NJ (US);

Jen-Hau Cheng, New Providence, NJ (US);

Paul R. Kolodner, Hoboken, NJ (US);

Krishna-Murty Kota-Venkata, Springfield, NJ (US);

William Scofield, Batavia, IL (US);

Todd R. Salamon, New Providence, NJ (US);

Maria E. Simon, New Providence, NJ (US);

Assignee:

Alcatel Lucent, Paris, FR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
Abstract

An apparatus comprising a rack having a row of shelves, each shelf supporting an electronics circuit board, each one of the circuit boards being manually removable from the shelve supporting the one of the circuit boards and having a local heat source thereon. The apparatus also comprises a cooler attached to the rack and being able to circulate a cooling fluid around a channel forming a closed loop. The apparatus further comprises a plurality of heat conduits, each heat conduit being located over a corresponding one of the circuit boards and forming a path to transport heat from the local heat source of the corresponding one of the circuit boards to the cooler. Each heat conduit is configured to be manually detachable from the cooler or the circuit board, without breaking a circulation pathway of the fluid through the cooler.


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