The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 24, 2013

Filed:

Apr. 27, 2011
Applicants:

Atsushi Motoya, Shiga, JP;

Kazuyuki Okano, Nara, JP;

Minako Akai, Kyoto, JP;

Yurika Goto, Aichi, JP;

Naoki Tagami, Osaka, JP;

Makoto Horiuchi, Nara, JP;

Toshio Mori, Kyoto, JP;

Takaari Uemoto, Osaka, JP;

Masahiro Miki, Osaka, JP;

Inventors:

Atsushi Motoya, Shiga, JP;

Kazuyuki Okano, Nara, JP;

Minako Akai, Kyoto, JP;

Yurika Goto, Aichi, JP;

Naoki Tagami, Osaka, JP;

Makoto Horiuchi, Nara, JP;

Toshio Mori, Kyoto, JP;

Takaari Uemoto, Osaka, JP;

Masahiro Miki, Osaka, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01);
U.S. Cl.
CPC ...
Abstract

An object of the present invention is to provide a mounting substrate, a manufacturing method, a light-emitting module and an illumination device that can sufficiently improve the luminous efficiency of an LED lamp. A mounting substrate according to the present invention includes a substrate and a reflective film that is formed on a front surface of the substrate and has a front surface on which LED chips are to be mounted, and the reflective film is made of metal oxide microparticles and a glass frit, and reflects light from the LED chips.


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