The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 24, 2013
Filed:
Oct. 15, 2008
Jong Wan Hong, Daejeon, KR;
Jang Soon Kim, Daejeon, KR;
Hyo Soon Park, Daejeon, KR;
Hyun Jee Yoo, Daejeon, KR;
Dong Han Kho, Daegu, KR;
Hyo Sook Joo, Anyang-si, KR;
Jong Wan Hong, Daejeon, KR;
Jang Soon Kim, Daejeon, KR;
Hyo Soon Park, Daejeon, KR;
Hyun Jee Yoo, Daejeon, KR;
Dong Han Kho, Daegu, KR;
Hyo Sook Joo, Anyang-si, KR;
LG Chem, Ltd., Seoul, KR;
Abstract
The present invention relates to a dicing die bonding film, which is able to maintain good workability and reliability in any semiconductor packaging process, such as adhesive property, gap filling property and pick-up property, while controlling burr incidence in a dicing process and thus contamination of die, and a dicing method. Specifically, the present invention is characterized by optimizing tensile characteristics of the dicing die bonding film, or carrying out the dicing on the parts of the die bonding film in the dicing process and separating it through an expanding process. Therefore, the present invention may regulate physical properties of films so as to have the maximized adhesive property, pick-up property and gap filling property without any specific restriction, while controlling burr incidence in the dicing process and contamination of die. As a result, workability and reliability in a packaging process may be excellently maintained.