The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 24, 2013
Filed:
Jun. 16, 2004
Takeshi Inaba, Settsu, JP;
Takeshi Inaba, Settsu, JP;
Daikin Industries, Ltd., Osaka, JP;
Abstract
It is an object of the present invention to provide a laminated resin molding which comprises a layer of a thermoplastic polymer such as a thermoplastic elastomer and a layer of a thermoplastic resin such as a fluorine-containing ethylenic polymer, is excellent in liquid chemical impermeability, chemical resistance and bacteria resistance, among others, and can be molded by coextrusion without causing foaming or deterioration of the thermoplastic elastomer and, further, has good interlaminar adhesive strength. The invention provides a laminated resin molding comprising a thermoplastic polymer layer (A), a polyamide-based resin layer (B) and a thermoplastic resin layer (C), wherein said thermoplastic polymer layer (A), said polyamide-based resin layer (B) and said thermoplastic resin layer (C) are laminated in that order and firmly adhered to one another, said thermoplastic polymer is to adhere to the polyamide-based resin by thermal fusion bonding, said polyamide-based resin has an amine value of 10 to 60 (equivalents/10g), said thermoplastic resin contains a functional group and is to thereby firmly adhere to said polyamide-based resin by thermal fusion bonding, said functional group contains carbonyl group.