The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 24, 2013
Filed:
Nov. 21, 2008
Takayuki Higuchi, Osaka, JP;
Hidenori Miyakawa, Osaka, JP;
Atsushi Yamaguchi, Osaka, JP;
Arata Kishi, Osaka, JP;
Naomichi Ohashi, Osaka, JP;
Takayuki Higuchi, Osaka, JP;
Hidenori Miyakawa, Osaka, JP;
Atsushi Yamaguchi, Osaka, JP;
Arata Kishi, Osaka, JP;
Naomichi Ohashi, Osaka, JP;
Panasonic Corporation, Osaka, JP;
Abstract
Disclosed is an electrically conductive paste which enables to reduce the level of void growth in a conducting pathway formed in a joint part produced after curing the electrically conductive paste in the implementation of an electronic component on a circuit board by using the electrically conductive paste, and which contains a reduced amount of a viscosity-adjusting/thixotropy-imparting additive. Two Sn-containing low-melting-point alloy particles having different melting points and different average particle diameters are selected as electrically conductive filler components to be used in an electrically conductive paste, and the two alloy particles are mixed at a predetermined ratio for use.