The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 24, 2013
Filed:
Feb. 27, 2008
Shuzo Sano, Tokyo, JP;
Akifumi Sako, Tokyo, JP;
Takashi Kobayashi, Tokyo, JP;
Mikio Izumi, Tokyo, JP;
Shuzo Sano, Tokyo, JP;
Akifumi Sako, Tokyo, JP;
Takashi Kobayashi, Tokyo, JP;
Mikio Izumi, Tokyo, JP;
Hitachi Medical Corporation, Tokyo, JP;
Abstract
An ultrasonic probe () comprises a cMUT chip (), which has a plurality of vibration elements whose electromechanical coupling coefficient or the sensitivity changes depending on a bias voltage, and transmits/receives an ultrasonic wave; an acoustic lens () provided on the ultrasonic wave radiation side of the cMUT chip (); a backing layer () provided on the back side of the cMUT chip () for absorbing propagation of the ultrasonic wave; an electric wiring portion (flexible substrate ()), which is provided from the peripheral portion of the cMUT chip () to the side face of the backing layer () and has a signal pattern connected with the electrode of the cMUT chip () arranged thereon; and a housing (ultrasonic probe cover ()) for containing the cMUT chip (), the acoustic lens (), the backing layer () and the electric wiring portion (flexible substrate ()). A ground layer (conductive film ()) of ground potential is provided on the ultrasonic wave radiation side of the cMUT chip ().