The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 24, 2013

Filed:

Oct. 27, 2011
Applicants:

Teruyuki Ohnishi, Atsugi, JP;

Shinichi Isobe, Ebina, JP;

Kohtaro Shiino, Isehara, JP;

Toru Takahashi, Hiratsuka, JP;

Inventors:

Teruyuki Ohnishi, Atsugi, JP;

Shinichi Isobe, Ebina, JP;

Kohtaro Shiino, Isehara, JP;

Toru Takahashi, Hiratsuka, JP;

Assignee:

Hitachi Automotive Systems, Ltd., Hitachinaka-shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 9/05 (2006.01);
U.S. Cl.
CPC ...
Abstract

A connecting structure to connect electronic components electrically through a plurality of conducting lines each including a covered segment including a wire conductor covered with an insulating covering and an uncovered segment includes a molding unit and a sealing unit. The molding unit encloses a boundary portion between the covered segment and the uncovered segment of each of the conducting lines so that the uncovered segments project in a first direction from a first end of the molding unit and the covered segments project in a second direction from a second end of the molding unit, and thereby holding the conducting lines to fix positions of the conducting lines relative to one another. The sealing member of an adhesive adheres to the second end of the molding unit and adheres to each of the covered segments of the conducting lines projecting from the second end of the molding unit.


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