The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 17, 2013
Filed:
Jul. 20, 2012
Kong Weng Lee, San Jose, CA (US);
James Yonghong Guo, Fremont, CA (US);
Vincent V. Wong, Los Altos, CA (US);
Jay A. Skidmore, San Jose, CA (US);
An-chun Tien, San Jose, CA (US);
Kong Weng Lee, San Jose, CA (US);
James Yonghong Guo, Fremont, CA (US);
Vincent V. Wong, Los Altos, CA (US);
Jay A. Skidmore, San Jose, CA (US);
An-Chun Tien, San Jose, CA (US);
JDS Uniphase Corporation, Milpitas, CA (US);
Abstract
The present invention relates to the packaging of high power laser(s) in a surface mount technology (SMT) configuration at low-cost using wafer-scale processing. A reflective sidewall is used to redirect the output emission from edge-emitting lasers through an optical element (e.g., a diffuser, lens, etc.). A common electrical pad centered inside the package provides p-side connection to multiple laser diodes (i.e. for power scalability). Thick plating (e.g. 75 um to 125 um) with a heat and electrically conductive material, e.g. copper, on a raised bonding area of a substrate provides good heat dissipation and spreading to the substrate layer during operation. The composite CTE of the substrate layer, e.g. AlN, and the heat/electrical conductive plating, e.g. Cu, substantially matches well with the laser substrates, e.g. GaAs-based, without the requirement for an additional submount.