The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 17, 2013
Filed:
Dec. 19, 2011
Masato Higuchi, Fukuoka, JP;
Yasuhiko Kawanami, Fukuoka, JP;
Katsushi Terazono, Fukuoka, JP;
Koji Higashikawa, Fukuoka, JP;
Akira Sasaki, Fukuoka, JP;
Takayuki Morihara, Fukuoka, JP;
Takashi Aoki, Fukuoka, JP;
Tetsuya Ito, Fukuoka, JP;
Yukihisa Nakabayashi, Fukuoka, JP;
Tasuku Isobe, Fukuoka, JP;
Kiyonori Koguma, Fukuoka, JP;
Masato Higuchi, Fukuoka, JP;
Yasuhiko Kawanami, Fukuoka, JP;
Katsushi Terazono, Fukuoka, JP;
Koji Higashikawa, Fukuoka, JP;
Akira Sasaki, Fukuoka, JP;
Takayuki Morihara, Fukuoka, JP;
Takashi Aoki, Fukuoka, JP;
Tetsuya Ito, Fukuoka, JP;
Yukihisa Nakabayashi, Fukuoka, JP;
Tasuku Isobe, Fukuoka, JP;
Kiyonori Koguma, Fukuoka, JP;
Kabushiki Kaisha Yaskawa Denki, Kitakyushu-Shi, JP;
Abstract
A wiring board includes a conductor plate including a wiring portion and an electrode portion connected to a power conversion semiconductor element, a liquid-cooling pipe mounted near the conductor plate and causing a cooling liquid to be supplied therethrough, and an insulating resin material arranged at least between the conductor plate and the liquid-cooling pipe.