The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 17, 2013

Filed:

Nov. 20, 2009
Applicants:

Rohn Sauer, Encino, CA (US);

Clifton Quan, Arcadia, CA (US);

David E. Roberts, San Pedro, CA (US);

Scott Johnson, Torrance, CA (US);

Inventors:

Rohn Sauer, Encino, CA (US);

Clifton Quan, Arcadia, CA (US);

David E. Roberts, San Pedro, CA (US);

Scott Johnson, Torrance, CA (US);

Assignee:

Raytheon Company, Waltham, MA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 1/28 (2006.01); H01Q 13/10 (2006.01);
U.S. Cl.
CPC ...
Abstract

The present invention relates to panel array antennas, and more particularly to a cooling system for an antenna such as a jet stream conformal panel array antenna. In one embodiment, a panel array antenna for an aircraft includes a closed-loop fluid flow path that passes through the panel array assembly and dissipates heat to the jet stream outside the aircraft. A fluid such as pressurized air passes through this closed-loop path, flowing through strategically-placed openings in the layers of the panel array assembly and flowing over and around the hot electrical components in the panel assembly. The air is heated by these electrical components, and the heated air then flows through the flow path under the top sheet, dissipating the heat to the jet stream outside. In one embodiment, a panel array antenna includes a panel assembly having a top layer through which the antenna radiates or receives a signal, and a fluid flow path through the panel assembly. A first portion of the fluid flow path is disposed below the top layer such that a fluid passing through the first portion of the fluid flow path is in heat transfer proximity to the top layer.


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