The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 17, 2013
Filed:
Aug. 23, 2012
Applicants:
Hiroshi Nakamura, Tokyo, JP;
Tomohiro Igarashi, Tokyo, JP;
Inventors:
Hiroshi Nakamura, Tokyo, JP;
Tomohiro Igarashi, Tokyo, JP;
Assignee:
Taiyo Yuden Co., Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01P 5/12 (2006.01); H01P 1/213 (2006.01); H03H 9/70 (2006.01); H03H 9/72 (2006.01);
U.S. Cl.
CPC ...
Abstract
Provided is a high-frequency circuit module that has high mounting density. In a high-frequency circuit module, an RFICthat performs transmission and reception processes for high-frequency signals, a power amplifier ICthat amplifies a transmission signal from the RFIC, and a duplexerthat separates a transmission signal outputted from the power amplifier ICto an antenna and a reception signal that is inputted from the antenna to the RFICare formed on the top surface thereof. The duplexeris disposed between the RFICand the power amplifier IC