The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 17, 2013
Filed:
Feb. 05, 2009
Yoshio Kameda, Tokyo, JP;
Masamoto Tago, Tokyo, JP;
Yoshihiro Nakagawa, Tokyo, JP;
Koichiro Noguchi, Tokyo, JP;
Yoshio Kameda, Tokyo, JP;
Masamoto Tago, Tokyo, JP;
Yoshihiro Nakagawa, Tokyo, JP;
Koichiro Noguchi, Tokyo, JP;
NEC Corporation, Tokyo, JP;
Abstract
A semiconductor inspecting device comprises a probe card for transmitting a signal or power supply to semiconductor wafers having one or more subject chips formed therein, and is constituted such that the first semiconductor wafer faces the first face of the probe card and such that the second semiconductor wafer faces the second face of the probe card on the opposite side of the first face. The probe card includes one or more inspecting chips, which can perform non-contact transmissions with the first subject chip in the first semiconductor wafer and the second subject chip in the second semiconductor wafer.