The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 17, 2013
Filed:
Jul. 20, 2010
Thomas Dungan, Fort Collins, CO (US);
Peter Mark O'neill, Fort Collins, CO (US);
Thomas Dungan, Fort Collins, CO (US);
Peter Mark O'Neill, Fort Collins, CO (US);
Abstract
A tiered integrated circuit (IC) assembly includes stacks of a limited number of ICs coupled to each other and arranged in a first direction across a base tier and a second tier. The base tier includes ICs and a data bridge. Each of the ICs includes a respective array of through silicon vias (TSVs) arranged in parallel with the first direction. The data bridge includes submicron metal interconnects (densely spaced electrical conductors) arranged in a plane that is substantially orthogonal to the first direction. The second tier is adjacent to the base tier and includes respective high-performance ICs different from the ICs of the base tier. The TSVs provide power and ground paths to the ICs in the second tier. In an example embodiment, the ICs in the second tier support one or more data bridges for connecting adjacent stacks.