The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 17, 2013
Filed:
Oct. 09, 2007
Katsumi Kikuchi, Minato-ku, JP;
Shintaro Yamamichi, Minato-ku, JP;
Hideya Murai, Minato-ku, JP;
Katsumi Maeda, Minato-ku, JP;
Takuo Funaya, Minato-ku, JP;
Kentaro Mori, Minato-ku, JP;
Takehiko Maeda, Kawasaki, JP;
Masaya Kawano, Kawasaki, JP;
Yuuji Kayashima, Kawasaki, JP;
Katsumi Kikuchi, Minato-ku, JP;
Shintaro Yamamichi, Minato-ku, JP;
Hideya Murai, Minato-ku, JP;
Katsumi Maeda, Minato-ku, JP;
Takuo Funaya, Minato-ku, JP;
Kentaro Mori, Minato-ku, JP;
Takehiko Maeda, Kawasaki, JP;
Masaya Kawano, Kawasaki, JP;
Yuuji Kayashima, Kawasaki, JP;
Renesas Electronics Corporation, Kanagawa, JP;
Abstract
A semiconductor device including a metal frame having a penetrating opening; a semiconductor chip provided in the opening; an insulating layer provided on the upper surface of the metal frame such that the insulating layer covers the upper surface, which is the circuit-formed surface of the semiconductor chip; an interconnect layer provided only on the upper-surface side of the metal frame with intervention of the insulating material and electrically connected to a circuit of the semiconductor chip; a via conductor provided on the upper surface of said semiconductor chip to electrically connect the circuit of the semiconductor chip and the interconnect layer; and a resin layer provided on the lower surface of the metal frame.