The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 17, 2013
Filed:
Jun. 09, 2011
Yung-chieh Chen, Tu-Cheng, TW;
Shou-kuo Hsu, Tu-Cheng, TW;
Hsien-chuan Liang, Tu-Cheng, TW;
Shin-ting Yen, Tu-Cheng, TW;
Dan-chen Wu, Tu-Cheng, TW;
Yung-Chieh Chen, Tu-Cheng, TW;
Shou-Kuo Hsu, Tu-Cheng, TW;
Hsien-Chuan Liang, Tu-Cheng, TW;
Shin-Ting Yen, Tu-Cheng, TW;
Dan-Chen Wu, Tu-Cheng, TW;
Hon Hai Precision Industry Co., Ltd., New Taipei, TW;
Abstract
A printed circuit board includes a first signal layer, a first reference layer, a second signal layer, and a third signal layer in that order and includes a first slanted via and a second slanted via. The first signal layer includes an parallel first transmission wire and a second transmission wire. The first and second transmission wires are coupled with each other and cooperatively constitute a first differential pair with an edge-coupled structure. The second signal layer includes a third transmission wire. The third signal layer includes a fourth transmission wire parallel to and coupled with the third transmission wire. The third and fourth transmission wires cooperatively constitute a second differential pair with a broadside-coupled structure. The first slanted via obliquely are interconnected between the first transmission wire and the third transmission wire. The second slanted via obliquely are interconnected between the second transmission wire and the fourth transmission wire.