The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 17, 2013
Filed:
Jun. 02, 2011
Applicants:
Tze Yang Hin, Penang, MY;
Stefan Martens, Munich, DE;
Werner Simbuerger, Haar, DE;
Helmut Wietschorke, Laberweinting, DE;
Horst Theuss, Wenzenbach, DE;
Beng Keh See, Melaka, MY;
Ulrich Krumbein, Rosenheim, DE;
Inventors:
Tze Yang Hin, Penang, MY;
Stefan Martens, Munich, DE;
Werner Simbuerger, Haar, DE;
Helmut Wietschorke, Laberweinting, DE;
Horst Theuss, Wenzenbach, DE;
Beng Keh See, Melaka, MY;
Ulrich Krumbein, Rosenheim, DE;
Assignee:
Infineon Technologies AG, Neubiberg, DE;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
Abstract
In one embodiment a method for manufacturing a semiconductor device comprises arranging a wafer on a carrier, the wafer comprising singulated chips; bonding the singulated chips to a support wafer, and removing the carrier.