The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 17, 2013
Filed:
Oct. 12, 2010
Masanori Maruno, Nara-ken, JP;
Yoshinao Taniguchi, Miyagi-ken, JP;
Yoshihiro Taguchi, Miyagi-ken, JP;
Masanori Maruno, Nara-ken, JP;
Yoshinao Taniguchi, Miyagi-ken, JP;
Yoshihiro Taguchi, Miyagi-ken, JP;
Alps Electric Co., Ltd., Tokyo, JP;
Abstract
A microchip plate made such that polymer substrates made, in particular, of a cycloolefin polymer (COP) or a cycloolefin copolymer (COC) can be appropriately bonded to each other and a process for producing the microchip plate are provided. A microchip plate () of an embodiment is constituted by a first substrate () and a second substrate (), which are bonded to each other through an adhesive layer (), wherein the first substrate () and the second substrate () are formed by a COP or a COC, and the adhesive layer () is formed of paraffin or naphthene or formed including paraffin or naphthene and at least any one of an adhesion auxiliary material, a polymer constituting each of the first substrate and the second substrate, and a macromonomer.