The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 17, 2013
Filed:
Sep. 14, 2012
Bowden Kirkpatrick, Bennington, VT (US);
Mark Ernest Vermilyea, Niskayuna, NY (US);
Mitchell Harold Boyer, Cincinnati, OH (US);
Ming Xie, Beavercreek, OH (US);
Elliott Keller Schulte, Dallas, TX (US);
Benjamin Wayne Ferrell, Cincinnati, OH (US);
Bowden Kirkpatrick, Bennington, VT (US);
Mark Ernest Vermilyea, Niskayuna, NY (US);
Mitchell Harold Boyer, Cincinnati, OH (US);
Ming Xie, Beavercreek, OH (US);
Elliott Keller Schulte, Dallas, TX (US);
Benjamin Wayne Ferrell, Cincinnati, OH (US);
General Electric Company, Niskayuna, NY (US);
Abstract
An apparatus and methods for manufacturing a flanged component from a composite lay-up are provided. The apparatus includes a support structure coupled to the composite lay-up and a mold ring coupled to the support structure. The mold ring includes a ring guide surface and a radial contact surface that is configured to couple to the composite lay-up. The apparatus further includes a mold plate coupled to the mold ring. The mold plate includes a recessed surface and a plate guide surface, where the recessed surface is configured to couple to the composite lay-up and the plate guide surface is configured to couple to the ring guide surface. The apparatus also includes an autoclave that applies pressure to the mold ring and the mold plate to move the plate guide surface along the ring guide surface to apply pressure to the composite lay-up.