The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 17, 2013

Filed:

Apr. 12, 2011
Applicants:

William C. Berg, Lakeville, MN (US);

Gary L. Johnson, St. Paul, MN (US);

Joshua M. J. Muonio, Lakeville, MN (US);

Inventors:

William C. Berg, Lakeville, MN (US);

Gary L. Johnson, St. Paul, MN (US);

Joshua M. J. Muonio, Lakeville, MN (US);

Assignee:

Analog Technologies Corp., Lakeville, MN (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F21V 7/20 (2006.01);
U.S. Cl.
CPC ...
Abstract

A light emitting diode (LED) lighting system and method is inherently configurable into a variety of new and retrofit lamp applications. This reduces fixture costs by incorporating the heat removal method, light guide system, and a chassis into one easy to assemble and install structure. It also allows for configuration of a lighting system for determining overall height, overall inner and outer radii, light directivity, lighting intensity, and thermal performance. In retrofit applications, the lighting system can be configured to minimize installation costs. In a preferred embodiment, a LED lighting system is comprised of sub assemblies of LED circuit strips or arrays conjoined to create a multifaceted structure. Each sub-assembly has LEDs mounted on a circuit substrate with conductors to electrically connect the LEDs. These circuits are thermally interfaced and attached to thermally conductive material selected, treated, or processed to obtain desired light reflecting properties. The thermal conductive material may be formed in any variety of ways, with consideration of surface area, fixture volume envelope and shape, and light directivity. Each LED sub-assembly circuit strip or array is electrically connected in series and/or parallel to a power supply.


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