The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 17, 2013
Filed:
Mar. 31, 2008
Applicants:
Mizuhisa Nihei, Kawasaki, JP;
Shintaro Sato, Kawasaki, JP;
Daiyu Kondo, Kawasaki, JP;
Yuji Awano, Kawasaki, JP;
Inventors:
Mizuhisa Nihei, Kawasaki, JP;
Shintaro Sato, Kawasaki, JP;
Daiyu Kondo, Kawasaki, JP;
Yuji Awano, Kawasaki, JP;
Assignee:
Fujitsu Semiconductor Limited, Yokohama, JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01R 43/00 (2006.01); H05K 1/09 (2006.01);
U.S. Cl.
CPC ...
Abstract
A CNT bundle is formed by growing a plurality of CNTs from opposing surfaces of contact blocks toward mutual opposing surfaces, and by contacting the CNTs so that they intersect to electrically connect with each other. Subsequently, a gap of the electrically connected CNT bundle is filled with a metal material, to thereby form a wiring being a composite state of the CNT bundle and the metal material.