The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 10, 2013

Filed:

Sep. 30, 2011
Applicants:

Takuji Onuma, Kanagawa, JP;

Kenichi Hidaka, Kanagawa, JP;

Hiromichi Takaoka, Kanagawa, JP;

Yoshitaka Kubota, Kanagawa, JP;

Hiroshi Tsuda, Kanagawa, JP;

Kiyokazu Ishige, Kanagawa, JP;

Inventors:

Takuji Onuma, Kanagawa, JP;

Kenichi Hidaka, Kanagawa, JP;

Hiromichi Takaoka, Kanagawa, JP;

Yoshitaka Kubota, Kanagawa, JP;

Hiroshi Tsuda, Kanagawa, JP;

Kiyokazu Ishige, Kanagawa, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/76 (2006.01); H01L 29/78 (2006.01);
U.S. Cl.
CPC ...
Abstract

An antifuse whose internal written information cannot be analyzed even by utilizing methods to determine whether there is a charge-up in the electrodes. The antifuse includes a gate insulation film, a gate electrode, and a first diffusion layer. A second diffusion layer is isolated from the first diffusion layer by way of a device isolator film, and is the same conduction type as the first diffusion layer. The gate wiring is formed as one integrated piece with the gate electrode, and extends over the device isolator film. A common contact couples the gate wiring to the second diffusion layer. The gate electrode is comprised of semiconductor material such as polysilicon that is doped with impurities of the same conduction type as the first diffusion layer. The second diffusion layer is coupled only to the common contact.


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