The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 10, 2013
Filed:
Dec. 08, 2009
Applicants:
Kenichi Kawabata, Tokyo, JP;
Takaaki Morita, Tokyo, JP;
Inventors:
Kenichi Kawabata, Tokyo, JP;
Takaaki Morita, Tokyo, JP;
Assignee:
TDK Corporation, Tokyo, JP;
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/16 (2006.01);
U.S. Cl.
CPC ...
Abstract
A multilayer circuit board comprises core layersandmade of a core material impregnated with resin, resin layersandinterposed between the core layersand, a wiring patternembedded in the resin layersand. The core layersandhave a thickness of 100 μm or smaller, whereby the entire board can significantly be thinned. Furthermore, the less strong resin layersandare interposed between the hard core layersand, whereby the entire board has increased strength.