The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 10, 2013
Filed:
Aug. 01, 2011
Shinnosuke Maeda, Nagoya, JP;
Satoshi Hirano, Chita-gun, JP;
Shinnosuke Maeda, Nagoya, JP;
Satoshi Hirano, Chita-gun, JP;
NGK Spark Plug Co., Ltd., Nagoya, JP;
Abstract
A multilayer wiring substrate includes a laminate structure in which resin insulation layers and conductor layers are alternately laminated. The resin insulation layers include first-type resin insulation layers, and second-type resin insulation layers, each of which contains an inorganic material in a larger amount and is smaller in thermal expansion coefficient as compared with first-type resin insulation layers. On a cross section of the laminate structure taken along a thickness direction thereof, the ratio of a total thickness of the second-type resin insulation layers located in an area Ato a thickness corresponding to the area Ais greater than the ratio of a total thickness of the second-type resin insulation layers located in an area Ato a thickness corresponding to the area A. The laminate structure is warped such that the laminate structure is convex toward the side where the second main face is present.