The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 10, 2013
Filed:
Mar. 25, 2011
Tomoko Tamura, Atsugi, JP;
Eiji Sugiyama, Tochigi, JP;
Yoshitaka Dozen, Tochigi, JP;
Koji Dairiki, Isehara, JP;
Takuya Tsurume, Tochigi, JP;
Tomoko Tamura, Atsugi, JP;
Eiji Sugiyama, Tochigi, JP;
Yoshitaka Dozen, Tochigi, JP;
Koji Dairiki, Isehara, JP;
Takuya Tsurume, Tochigi, JP;
Semiconductor Energy Laboratory Co., Ltd., Atsugi-shi, Kanagawa-ken, JP;
Abstract
A release layer formed over a substrate; at least one of thin film integrated circuits is formed over the release layer; a film is formed over each of the at least one of thin film integrated circuits; and the release layer is removed by using an etchant; thus, the at least one of thin film integrated circuits is peeled from the substrate. A semiconductor device is formed by sealing the peeled thin film integrated circuit by lamination or the like.