The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 10, 2013
Filed:
Aug. 03, 2009
James H. Adair, State College, PA (US);
Mary Frecker, State College, PA (US);
Christopher Muhlstein, University Park, PA (US);
Eric Mockensturm, State College, PA (US);
Harriet Black Nembhard, University Park, PA (US);
Randy S. Haluck, Lititz, PA (US);
Abraham Mathew, Hershey, PA (US);
Nicholas Antolino, University Park, PA (US);
Gregory R Hayes, State College, PA (US);
Milton Aguirre, State College, PA (US);
Rebecca Kirkpatrick, University Park, PA (US);
Chumpol Yuangyai, University Park, PA (US);
James H. Adair, State College, PA (US);
Mary Frecker, State College, PA (US);
Christopher Muhlstein, University Park, PA (US);
Eric Mockensturm, State College, PA (US);
Harriet Black Nembhard, University Park, PA (US);
Randy S. Haluck, Lititz, PA (US);
Abraham Mathew, Hershey, PA (US);
Nicholas Antolino, University Park, PA (US);
Gregory R Hayes, State College, PA (US);
Milton Aguirre, State College, PA (US);
Rebecca Kirkpatrick, University Park, PA (US);
Chumpol Yuangyai, University Park, PA (US);
The Penn State Research Foundation, University Park, PA (US);
Abstract
A polycrystalline mesoscale component, formed through a process including filing a mold cavity formed in a photoresist with a mold fill, is provided with an overall length L divided into multiple segments with a second segment extending from a first segment at a nonlinear angle. The first segment has a first segment height H1 and a first segment thickness T1, while the second segment has a second segment height H2 and a second segment thickness T2, with the lesser of H1 and H2 defining a minimum segment height Hmin and the lesser of T1 and T2 defining a minimum segment thickness Tmin. The resultant component has a ratio of L:Hmin:Tmin of 20-80:1:0.5-10 where Hmin is between 5 and 500 microns. In specific instances, the nonlinear angle is acute, the multiple segments are rectilinear in cross section, and a segment thickness has an edge resolution of between 0.1 and 2 microns.