The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 10, 2013
Filed:
Mar. 31, 2006
Seiichi Matsuoka, Tokyo, JP;
Shigeru Nezu, Tokyo, JP;
Akihide Shimoda, Fuji, JP;
Masato Suzuki, Fuji, JP;
Toshio Nakane, Fuji, JP;
Seiichi Matsuoka, Tokyo, JP;
Shigeru Nezu, Tokyo, JP;
Akihide Shimoda, Fuji, JP;
Masato Suzuki, Fuji, JP;
Toshio Nakane, Fuji, JP;
Fuji Jukogo Kabushiki Kaisha, Tokyo, JP;
Polyplastics Co., Ltd, Tokyo, JP;
Abstract
A resin composition formed by mixing 99 to 70 weight % of specific whole aromatic polyesteramide liquid crystal resin (A) with 1 to 30 weight % of epoxy modified polyolefin-base resin (B) and by melting and kneading both of the resins, wherein the resin composition having a melt viscosity of 60 to 4000 Pa·s at a shear rate of 1000/second at a temperature which is 20° C. higher than the melting point and having a melt tension of 20 mN or more at a take-over speed of 14.8 m/minute, is melt within a temperature range of a melting point to the melting point +40° C., a parison (P) is formed by extruding it with an extrusion speed equal to or higher than 0.3 kg/minute and lower than 5 kg/minute, a pair of moldings placed so as to sandwich the parison (P) are closed at a predetermined mold closing pressure, and air is blown into the parison (P).