The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 03, 2013
Filed:
Apr. 12, 2012
Applicants:
Atsushi Saito, Chino, JP;
Kazuo Aoki, Chino, JP;
Shintaro Yoshitome, Chino, JP;
Inventors:
Assignee:
Seiko Epson Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G03B 21/56 (2006.01);
U.S. Cl.
CPC ...
Abstract
A method for manufacturing an array substrate includes forming a plurality of holes in a film shape substrate having thermal plasticity, in which the holes have a diameter of 0.25 times to 2 times a thickness of the substrate, and a pitch of 5 times to 40 times the diameter of the holes; and heating a molding member provided with a plurality of convex portions or concave portions in an array pattern, pressing the substrate provided with the plurality of holes, and transferring the plurality of convex portions or concave portions to the substrate.