The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 03, 2013

Filed:

Aug. 25, 2011
Applicants:

Thomas J. Bucelot, Wappingers Falls, NY (US);

Liang-teck Pang, White Plains, NY (US);

Phillip J. Restle, Katonah, NY (US);

Inventors:

Thomas J. Bucelot, Wappingers Falls, NY (US);

Liang-Teck Pang, White Plains, NY (US);

Phillip J. Restle, Katonah, NY (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G06F 1/04 (2006.01);
U.S. Cl.
CPC ...
Abstract

There is provided a clock distribution network for synchronizing global clock signals within a 3D chip stack having two or more strata. On each of the two or more strata, the clock distribution network includes a clock grid having a plurality of sectors for providing the global clock signals to various chip locations, a multiple-level buffered clock tree for driving the clock grid and including at least a root and a plurality of clock buffers, and one or more multiplexers for providing the global clock signals to at least a portion of the buffered clock tree. Inputs of at least some of the plurality of clock buffers on each of the two or more strata are shorted together using chip-to-chip interconnects to reduce skewing of the global clock signals with respect to the various chip locations.


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