The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 03, 2013
Filed:
Sep. 22, 2011
Applicants:
Hyun-ki Kim, Cheonan-si, KR;
Dae-young Choi, Yeosu-si, KR;
Mi-yeon Kim, Yongin-si, KR;
Inventors:
Assignee:
Samsung Electronics Co., Ltd., Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H05K 1/09 (2006.01); H05K 1/02 (2006.01); H05K 1/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
Provided are a printed circuit board (PCB) and a semiconductor package including the same. The PCB includes a core layer having a stacked structure including at least a first layer made of a first material that has a first coefficient of thermal expansion (CTE) and a second layer made of a second material that has a second CTE different from the first CTE, an upper wiring layer disposed on a first surface of the core layer, and a lower wiring layer disposed on a second surface of the core layer opposite the first surface.