The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 03, 2013
Filed:
Apr. 12, 2011
Nan-jang Chen, Hsinchu, TW;
Chun-wei Chang, New Taipei, TW;
Sheng-ming Chang, New Taipei, TW;
Che-yuan Jao, Hsinchu, TW;
Ching-chih LI, New Taipei, TW;
Nan-cheng Chen, Hsin-Chu, TW;
Nan-Jang Chen, Hsinchu, TW;
Chun-Wei Chang, New Taipei, TW;
Sheng-Ming Chang, New Taipei, TW;
Che-Yuan Jao, Hsinchu, TW;
Ching-Chih Li, New Taipei, TW;
Nan-Cheng Chen, Hsin-Chu, TW;
Mediatek Inc., Science-Based Industrial Park, Hsin-Chu, TW;
Abstract
A semiconductor package includes a die pad; a semiconductor die mounted on the die pad; a plurality of leads disposed along peripheral edges of the die pad; a ground bar between the leads and the die pad; and a plurality of bridges connecting the ground bar with the die pad, wherein a gap between two adjacent bridges has a length that is equal to or less than 3 mm.